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(CAS No.:614-45-9)Tert-Butyl peroxybenzoate
Tert-Butyl peroxybenzoate

。Product description
 tert-Butyl peroxybenzoate
 Active Oxygen content : 8.0%
 CAS No. : 614-45-9 
 Appearance : clear liquid
 Assay : 98.0% min.
 Color : 100 Pt-Co max.
 tert-Butyl hydroperoxide : 1000 mg/kg max.
 Inorganic + organic hydrolyzable chloride : 50 mg/kg max.

。Physical properties
 Density, 20℃ : 1040 kg/m3
 Viscosity, 20℃ : 6 mPa.s
 Freezing point : approx. 8℃

 Standard packaging size for LQ-TBPB is 25 kg net.
 Smaller packaging size is available on request.


1. Polymerization of styrene
 LQ-TBPB can be used for the polymerization and copolymerization of styrene in the temperature  
 range of 100-140℃. During polymerization the temperature is increased in steps.

2. Polymerization of acrylates and methacrylates
 LQ-TBPB can be used as initiator for the solution (co)polymerization of acrylates and 
 methcrylates in the temperatures range of 100-170℃, amongst others for the coatings.
 LQ-TBPB can also be applied as an initiator for the bulk and suspension (co)polymerization of  
 acrylates and methcrylates.

3. Polymerization of ethylene
 LQ-TBPB is an efficient initirtor for the ethylene polymerization under high pressure in both  
 autoclave and tubular processes.
 To obtain a wide spectrum of polymerization temperatures, combinations with other peroxides 
 are applied in practice.
 Depending on reaction conditions. LQ-TBPB is active in the temperature range of 220-270℃.

4. Other applications
 LQ-TBPB can also be used for the (co)polymerization of acrylonitrile and vinyl acetate.

5. Crosslinking Peroxides
 LQ-TBPB,is suitable for crosslinking of EPDM rubber compounds at ambient temperature within 
 some weeks.
 Rubber compounds containing LQ-TBPB have moderate processing safety in combination with a 
 very high speed of cure.

6. Peroxides for Thermoset Resins
 LQ-TBPB, tert-butyl peroxybenzoate, is an aromatic perester, which is used for the curing of 
 unsaturated polyester resins at elevated temperatures.
 LQ-TBPB is preferred for the curing of UP resin based Hot Press
 Moulding formulations (SMC, BMC, ZMC etc) in the temperature range of 120 - 170℃.

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